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  • High Temperature Curing Nanosilver Ink for Inkjet Printing(MGT-IJP-INK3050HT)
  • 2020-05-11
  • Product introduction: 

    High temperature curing inkjet printing nanosilver ink (MGT-IJP-INK3050HT) is a new type of high temperature sintered electronic material for digital printing deposition conductive circuit technology. The ink can realize the digital, non-contact, high-precision patterning distribution of large-area circuit conductors, and can be applied to various high-temperature substrates such as glass, ceramics, quartz, silicon wafers, etc. It can be sintered at a high temperature of about 600 degrees, and the printing circuit can be welded at high temperature.


    Product advantages: 

    1. Excellent conductivity 

    2. Very smooth printing 

    3. High content of silver nanoparticles 

    4. Good hardness and adhesion 

    5. High temperature sintering and welding 

    6. Suitable for special circuit printers 


    Main technical parameters:

    Test Items

    Performance Parameters

    Product System

    Eco-friendly solvent

    Silver Particle size

    30~50nm

    Viscosity (cp)

    8~10cp, adjustable

    Silver Content

    30~40wt%

    Electrical resistivity

    1~10mΩ//mil, 

              affected by  curing conditions

    Adhesion

    Level 0, 100% non-shedding

    Hardness

    2H


    Storage Conditions: 

    Long-term storage should be 0~10℃ tight sealed and away from light.  After refrigerating, it is naturally restored to normal temperature, it is recommended to mechanically stir for 10minutes, and the printing environment is 20~25℃. 



    Disclaimer : The information provided in this Technical Data Sheet (TDS) is compiled in good faith and obtained using procedures performed at Mogreat and to the best of our knowledge. The information on this TDS has been updated on the date printed, and latest versions can be obtained upon request. The customer is responsible for conducting tests to determine whether our products are compatible with the customer's process and specific applications.  


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